Products List
Via-in-pad PCB
1). 80 *190mm/2up, FR-4
2). 6 layers at 1.4mm thick
3). 35 μm copper weight
4). Green solder mask LPI/White legend
5). ENIG surface finish
6). Blind via from Layer 1 to layer 2
7). Via in pad plugged conductive...
ROGERS PCB
1) RO4350B and RO4003C
RO4350B
4mil(0.1mm)
10mil(0.254mm)
13.3mil(0.338mm)
20mil (0.508mm)
30mil(0.762mm)
60mil(1.524mm)
RO4003C
12mil(0.3mm)
20mil(0.508mm)
32mil(0.813mm)
60mil(1.524mm)
2) 1/1 oz copper thickness
3) Line space width: 0.15-0.2mm
4) Green solder mask/white ident
5) Immersion...
Heavy copper PCB
1). 6 oz (210μm) on BOT side.
2). 139.99*110.85mm=1 pcb
3). Base material: FR-4
4). 4 Layer, 1.6mm thick
5). Green solder mask/ white legend
6). Immersion gold.
7). Stack-up
---------- OVERLAY (TOP)
---------- SOLDER MASK (TOP)
----2oz------ LAYER 1 (TOP LAYER)
----0.46mm------ DIELECTRIC
----2oz------...
Quick turn PCB (Fast PCB)
1). Size: 72*90mm/1 up
2). Layer count: 4 Layer, 20 μm PTH
3). Thickness: 1.6mm +/- 10%
4). Copper weight(Finished): 35 μm
5). SMOBC: LPI Green solder mask/ White legend
6). Holes: 0.4mm minimum, 4/4 mil track/space
7). Pads finish: HASL
8). Fastest delivery time (calendar day)
2 Layer -- 1 days
4 Layer -- 3 days
6 Layer...
High Tg PCB
1). 90*90mm/1up, ITEQ IT180A, FR-4 Tg170
2). 10 layer, 1.6mm thick
3). 35 μm copper finished
4). LPI Green solder mask/ white legend
5). Immersion gold (ENIG)
6). Differential impedance control 90 ohm/100 ohm +/-10% on track 0.1mm
7). Good for high-count layer PCB, Widely used in computer, communication equipment, precise apparatus and...
Blind via PCB
1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias.
2). FR-4 Material, 1 oz weight.
3). 8 layer, 1.6mm thick.
4). 4/4 mils track and space
5). Min.drill 0.1mm
6). Green solder mask/ white silkscreen
7). Immersion gold over...
PCB prototypes
1). PCB prototypes to small volume.
2). FR-4, 0.3-5mm thick, 1-10 oz
3). 1-32 Layer
4). LPI Green solder mask/White legend
5). HASL, ENIG, OSP, Immersion silver
6). Blind via, Via in pad, Micro BGA
7). MOQ 1...
Impedance controlled PCB
1) L1 and L4, track /space(mil) 5.1/6, precision +/-10%
90 ohm differential impedance
L1, L2 and L4, track /space(mil) 6.1/7.8, precision +/-10%
100 ohm differential impedance
2). 230*230mm/1up, FR-4 Tg 170
3). 4 layers, 35 μm copper, 2.5mm thick
4). Min.track/space: 4/4 mil
5). Min. hole size: 0.25mm
6). Immersion gold
7). High...
High CTI PCB
1) 160*160mm, S1600 FR-4 CTI ≥ 600V,
2) 8 layer
3) Finished inner/outer: 35 μm
4) LPI Green mask/white silk
5) Min hole 0.19mm, 5/3 track/gap
6) 1.6mm +/-10% thick
7) Immersiong gold over nickel
8) High voltage, High temperature, moisture...
Double sided MCPCB
1. Aluminum core, 125*73mm=1PCB
2. Double sided
3. Thermal conductivity: 2.0W/MK
4. Green solder mask/ white text
5. 2 OZ copper finished
6. 2.4mm finished thickness
7. Immersion Gold
8. Plated through hole (PTH)
9. layer stack up
------solder mask
------copper 70μm (layer 1)
------dielectric thick 75μm
------aluminum core...